DocumentCode :
2608229
Title :
Electromigration Failure Under Pulse Test Conditions
Author :
Miller, R.J.
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598. 914-945-2665
fYear :
1978
fDate :
28581
Firstpage :
241
Lastpage :
247
Abstract :
Unpassivated aluminum thin-film conductors were subjected to pulsed dc currents at a frequency of 250 kHz, with duty factors ranging from 10% to 100%. Current densities of 4×106 A/cm2 and 1 × 107 A/cm2 were employed. Some tests were also performed at frequencies of 20 kHz and 100 kHz. The conductor lifetime was found to depend strongly on the pulse duty factor, with the mean time to failure, measured in on-time hours, showing a monotonic improvement as the duty factor of testing was decreased. At a pulse current density of 1 × 107 A/cm2, the results demonstrated the occurrence of electromigration in the direction of the "electron wind". A proportion of the improvement in the conductor lifetime is attributable to a decrease in the amount of conductor self-heating, particularly at a current density of 1 × 107 A/cm2; however, self-heating considerations cannot account for the entire improvement unless unusually large activation energies for grain boundary diffusion are assumed. The cause of the remainder of the improvement (not accounted for by self-heating) has not been determined; however, excess vacancy concentration, and its dependence on duty factor, may contribute to the lifetime improvement.
Keywords :
Aluminum; Conductive films; Conductors; Current density; Electromigration; Frequency; Performance evaluation; Pulse measurements; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1978.362853
Filename :
4208243
Link To Document :
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