Title :
Accuracy of turbulence models and CFD for thermal characterisation of electronic systems
Author :
Dhinsa, K. ; Bailey, C. ; Pericleous, K.
Author_Institution :
Old R. Naval Coll., Univ. of Greenwich, UK
Abstract :
A major percentage of the heat emitted from electronic packages can be extracted by air cooling whether by means of natural or forced convection. This flow of air throughout an electronic system and the heat extracted is highly dependable on the nature of turbulence present in the flow field. This paper will discuss results from an investigation into the accuracy of turbulence models to predict air cooling for electronic packages and systems.
Keywords :
computational fluid dynamics; cooling; electronic engineering computing; finite volume methods; flow simulation; forced convection; natural convection; temperature distribution; thermal management (packaging); turbulence; CFD; Navier Stokes equations; air cooling; effective viscosity; electronic packages; electronic systems; forced convection; heat transfer simulation; laminar viscosity; local velocity; low Reynolds number turbulence; natural convection; temperature profiles; thermal characterisation; turbulence models; Computational fluid dynamics; Educational institutions; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Fluid dynamics; Fluid flow; Numerical models; Predictive models; Temperature;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271573
