Title :
High performance low cost metal-filled composites for embedded passive applications [capacitor materials]
Author :
Xu, Jianwen ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
It is essential to find new candidate materials for embedded capacitors. This work presents the development of a novel aluminum-filled high dielectric constant composite. Aluminum is well known as a fast self-passivation and low-cost metal. The thin passivation layer forms an insulating boundary outside of the metallic spheres, which has dramatic effects on the electrical, mechanical, and chemical behaviors of the resulting composites. Influences of aluminum particle size and filler loading on the dielectric properties of composites have been studied. Due to the self-passivation nature of fine aluminum spheres, a high loading level of aluminum can be used while the composite materials continue to be insulating. Dielectric property measurement demonstrates that, for composites containing 80 wt% 3.0 m aluminum, a dielectric constant of 109 and a low dissipation factor of about 0.02 (@ 10 kHz) can be achieved. At such loading level, materials still show good processability and good adhesion toward the substrate. The developed aluminum composite is a promising candidate material for embedded capacitor applications.
Keywords :
aluminium; dielectric materials; filled polymers; passivation; permittivity; thin film capacitors; 10 kHz; Al; aluminum particle size; aluminum self-passivation; aluminum-filled composites; dielectric constant; dissipation factor; embedded capacitors; embedded passive components; epoxy resin polymer matrix; filled polymer composites; filler loading; fine aluminum spheres; high dielectric constant composite material; low cost metal-filled composites; Aluminum; Capacitors; Composite materials; Costs; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; High-K gate dielectrics; Inorganic materials; Passivation;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271581