• DocumentCode
    2608453
  • Title

    High performance low cost metal-filled composites for embedded passive applications [capacitor materials]

  • Author

    Xu, Jianwen ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2003
  • fDate
    10-12 Dec. 2003
  • Firstpage
    544
  • Lastpage
    550
  • Abstract
    It is essential to find new candidate materials for embedded capacitors. This work presents the development of a novel aluminum-filled high dielectric constant composite. Aluminum is well known as a fast self-passivation and low-cost metal. The thin passivation layer forms an insulating boundary outside of the metallic spheres, which has dramatic effects on the electrical, mechanical, and chemical behaviors of the resulting composites. Influences of aluminum particle size and filler loading on the dielectric properties of composites have been studied. Due to the self-passivation nature of fine aluminum spheres, a high loading level of aluminum can be used while the composite materials continue to be insulating. Dielectric property measurement demonstrates that, for composites containing 80 wt% 3.0 m aluminum, a dielectric constant of 109 and a low dissipation factor of about 0.02 (@ 10 kHz) can be achieved. At such loading level, materials still show good processability and good adhesion toward the substrate. The developed aluminum composite is a promising candidate material for embedded capacitor applications.
  • Keywords
    aluminium; dielectric materials; filled polymers; passivation; permittivity; thin film capacitors; 10 kHz; Al; aluminum particle size; aluminum self-passivation; aluminum-filled composites; dielectric constant; dissipation factor; embedded capacitors; embedded passive components; epoxy resin polymer matrix; filled polymer composites; filler loading; fine aluminum spheres; high dielectric constant composite material; low cost metal-filled composites; Aluminum; Capacitors; Composite materials; Costs; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; High-K gate dielectrics; Inorganic materials; Passivation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
  • Print_ISBN
    0-7803-8205-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1271581
  • Filename
    1271581