Title :
A performance analysis for single-walled metallic Carbon Nanotubes as global and intermediate on-chip interconnects
Author :
Hashempour, Hamidreza ; Lombardi, Fabrizio
Author_Institution :
Indep. Researcher, Tehran
Abstract :
This paper analyzes several delay estimates for metallic carbon nanotubes (CNT) as interconnects of very large scale integrated (VLSI) chips. A study of the 2005 edition of the international technology roadmap (ITRS) [1] for global/intermediate interconnects is presented to highlight the significant issues encountered with the projected performance of copper/aluminum interconnects till 2020. Then a worst case performance analysis of metallic CNTs is presented and compared versus copper interconnects. It is evaluated that the RC delay of CNTs does not meet the future RC delay requirements of on-chip intermediate and global wires.
Keywords :
VLSI; carbon nanotubes; delay estimation; integrated circuit interconnections; delay estimates; metallic carbon nanotubes; on-chip global wires; on-chip interconnects; on-chip intermediate wires; very large scale integrated chips; Carbon nanotubes; Conductivity; Copper; Delay estimation; Dielectric materials; Integrated circuit interconnections; Performance analysis; Solid modeling; Very large scale integration; Wires; Carbon Nanotube; Global Interconnect; Intermediate Interconnect; Metallic CNT; RC Delay;
Conference_Titel :
Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-0607-4
Electronic_ISBN :
978-1-4244-0608-1
DOI :
10.1109/NANO.2007.4601425
