Title :
The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging
Author :
Lahti, J.N. ; Delaney, R.H. ; Hines, J.N.
Author_Institution :
Bell Laboratories, Whippany, N. J. 07981. (201) 386-2725
Abstract :
This paper reviews the results of an extensive program to characterize the long-term performance of high density circuitry on glass-reinforced epoxy substrates. The data reveal potentially serious limitations in existing materials. The nature of the wearout mechanism will be described, and data on temperature, humidity, and voltage dependence will be reviewed.
Keywords :
Automatic control; Circuit testing; Conducting materials; Dielectrics; Electronics packaging; Humidity control; Materials testing; Printed circuits; Raw materials; Textile industry;
Conference_Titel :
Reliability Physics Symposium, 1979. 17th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1979.362869
