Automated solder joint inspection system using optical 3-D image detection

An automated system has been developed for visually inspecting the solder joints of SMDs (Surface Mounted Devices). The system is capable of inspecting fine pitch components down to 0.3 mm pitch QFPs (Quad Flat Packages). A unique image detection method was also developed to obtain precise 3-D images of solder joints. The principle of a confocal microscope is employed but plural sensors are used to detect reflected light at different focusing positions simultaneously. The system is unaffected by secondary reflection and dead angles. The warp in a PC (Printed Circuit) board surface is calculated in real time using the detected 3-D images, and board height to be detected in successive areas is predicted based on this calculation. Real-time automatic focusing control is then performed using newly developed defect detection algorithms, the system can recognize leads, pads and solder fillets from the detected images. Because 3-D shape features are extracted and used for defect judgment, user-defined parameters have been made easy to understand and/or to modify. Operational evaluation of the system confirms a 100% defect detection rate and a very low false alarm rate (0.16%)