Title :
Electromigration Depletions in Pb-Sn Films
Author :
Di Giacomo, Giulio
Author_Institution :
International Business Machines Corporation, P.O. Box 390, Poughkeepsie, New York 12602
Abstract :
This paper describes the electromigration depletions observed at 125° to 175°C in Pb-Sn films subjected to various current stress conditions up to 2×104 A/cm2. The total depleted volume grows linearly with time and current density. This linear growth consists of the individual depletion growth multiplied by the number of depletions at any time. Both size and number of depletions grow parabolically.
Keywords :
Aluminum; Chromium; Copper; Current density; Electromigration; Glass; Nitrogen; Stress; Testing; Tin;
Conference_Titel :
Reliability Physics Symposium, 1979. 17th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1979.362873
