DocumentCode :
2608717
Title :
Predictions of shape and temperature for heating elements in an electronic package by inverse heat transfer method
Author :
Cheng, Chin-Hsiang ; Chang, Mei-Hsia
Author_Institution :
Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
611
Lastpage :
619
Abstract :
The aim of this study is to present a novel inverse heat transfer method, which incorporates an automatic-filter scheme with the conjugate gradient method, for identifying shapes and temperature of heating elements embedded in a rectangular package. In this report, shapes of the heating elements are visualized by using node-matrix images. A group of unknown heating elements with different shapes, positions, and temperatures are nondestructively identified simply based on the data of the upper surface temperature of the rectangular package. Effects of temperature measurement uncertainty, grid size, and number of measurement points on the top surface on the identification accuracy are evaluated. Results show that the geometric and thermal conditions of the heating elements embedded can be predicted precisely by using the present approach. The approach is found to be stable and insensitive to the temperature measurement uncertainty, and without overwhelming mathematical manipulation, the form of objective function becomes flexible.
Keywords :
conjugate gradient methods; heat conduction; heating elements; identification; inverse problems; measurement uncertainty; temperature distribution; temperature measurement; thermal management (packaging); automatic-filter scheme; conjugate gradient method; electronic package; grid size; heat conduction equation; heating elements; identification accuracy; inverse heat transfer method; measurement uncertainty; node-matrix images; objective function; rectangular package; shape predictions; temperature predictions; Electronic packaging thermal management; Electronics packaging; Gradient methods; Heat engines; Heat transfer; Resistance heating; Shape; Solids; Temperature measurement; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
Type :
conf
DOI :
10.1109/EPTC.2003.1271592
Filename :
1271592
Link To Document :
بازگشت