DocumentCode :
2608726
Title :
Modeling and analyzing of electrowetting using electromagnetic body force density and surface tension
Author :
Sung, Tan Il ; Choi, Hong Soon ; Kim, Young Sun ; Park, Il Han
Author_Institution :
Sch. of Inf. & Commun. Eng., Sungkyunkwan Univ., Suwon, South Korea
fYear :
2010
fDate :
9-12 May 2010
Firstpage :
1
Lastpage :
1
Abstract :
The understanding of electrowetting phenomenon is an essential way for controlling tiny droplets on dielectric material surfaces. In conventional viewpoint, the shape of droplet is determined by the contact angle which is influenced by applied electric field. In this paper, we present a new approach to modeling and analyzing the electrowetting phenomenon. It is based on electromagnetic body force and surface tension as well as the initial contact angle. The pressures on the surface of droplet are calculated by using the revised Kelvin´s formula, the hydrostatic equation and the surface tension due to surface curvature. The electrowetting phenomenon was successfully modeled and analyzed using the proposed approach.
Keywords :
contact angle; drops; surface tension; wetting; applied electric field; contact angle; dielectric material surfaces; droplets; electromagnetic body force density; electrowetting; hydrostatic equation; surface curvature; surface tension; Dielectric liquids; Electromagnetic analysis; Electromagnetic forces; Electromagnetic modeling; Equations; Kelvin; Pressure control; Shape; Surface tension; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Field Computation (CEFC), 2010 14th Biennial IEEE Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-7059-4
Type :
conf
DOI :
10.1109/CEFC.2010.5481397
Filename :
5481397
Link To Document :
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