• DocumentCode
    2608858
  • Title

    Autoclave vs. 85°C/85% R. H. Testing - A Comparison

  • Author

    McGarvey, William J.

  • Author_Institution
    NCR Microelectronics, Colorado Springs, Colorado
  • fYear
    1979
  • fDate
    28946
  • Firstpage
    136
  • Lastpage
    142
  • Abstract
    The wide use of plastic encapsulated MOS-LSI integrated circuits (IC) has aroused much concern regarding moisture integrity testing. This paper discusses the results of both unbiased autoclave testing and 85°C/85% R.H. testing. Comparisons are made based on failure rate data, and a heuristic acceleration factor is determined.
  • Keywords
    Acceleration; Circuit testing; Failure analysis; Integrated circuit testing; Life estimation; Life testing; Logic testing; Moisture; Plastic packaging; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1979. 17th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1979.362883
  • Filename
    4208276
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2608858