DocumentCode :
2608858
Title :
Autoclave vs. 85°C/85% R. H. Testing - A Comparison
Author :
McGarvey, William J.
Author_Institution :
NCR Microelectronics, Colorado Springs, Colorado
fYear :
1979
fDate :
28946
Firstpage :
136
Lastpage :
142
Abstract :
The wide use of plastic encapsulated MOS-LSI integrated circuits (IC) has aroused much concern regarding moisture integrity testing. This paper discusses the results of both unbiased autoclave testing and 85°C/85% R.H. testing. Comparisons are made based on failure rate data, and a heuristic acceleration factor is determined.
Keywords :
Acceleration; Circuit testing; Failure analysis; Integrated circuit testing; Life estimation; Life testing; Logic testing; Moisture; Plastic packaging; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1979. 17th Annual
Conference_Location :
San Diego, CA, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1979.362883
Filename :
4208276
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2608858
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