Title :
Electro thermal analysis and fabrication of low cost microheater using a nickel alloy for low temperature MEMS based gas sensor application
Author :
Roy, Sunipa ; Majhi, Tanusree ; Sinha, Susmita ; Sarkar, C.K. ; Saha, H.
Author_Institution :
Dept. of Electron. & Telecommun. Eng., Jadavpur Univ., Kolkata, India
Abstract :
A stable and low power heating characteristics of a microheater are very important for the gas sensor platform. In this paper, we present a complete electrothermal and coplanar structure of a microheater for MEMS based gas sensor platform using a low cost nickel alloy Dilver PI (alloy of Ni, Co, Fe) having high resistivity 49*10-8Ωm and high yield stress 680MPa with low thermal conductivity 17.5W/m/°C. A comparative study has also been made with six different types of heater structures. Thermal electrical analysis was done using finite element modeling of Intellisuite 8.2. Microheater device of size 5mm × 5mm with a 50μ thick membrane of size 2mm*2mm are fabricated using a single lithographic mask. The maximum temperature of 200°C with a distribution of ± (2-3) % over the entire microheater membrane region has been achieved with 5V excitation. The power consumption 146 mW has been achieved.
Keywords :
finite element analysis; gas sensors; lithography; microfabrication; microsensors; nickel alloys; thermal conductivity; Dilver P1; Intellisuite 8.2; coplanar structure; electro thermal analysis; excitation; finite element modeling; gas sensor; heater structures; lithographic mask; low cost microheater; low power heating; low temperature MEMS; microfabrication; microheater membrane region; nickel alloy; resistivity; thermal conductivity; thermal electrical analysis; yield stress; Conferences; Gas detectors; Industrial electronics; Robot sensing systems; Service robots; Thermal sensors; Dilver PI; Electrothermal analysis; Gas sensor; IDE; MEMS; Microheater;
Conference_Titel :
Industrial Electronics, Control & Robotics (IECR), 2010 International Conference on
Conference_Location :
Orissa
Print_ISBN :
978-1-4244-8544-4
DOI :
10.1109/IECR.2010.5720155