Title :
Comparative study on solder joint reliability using different FE-models
Author :
Zhu, W.H. ; Stoeckl, S. ; Pape, H. ; Gan, S.L.
Author_Institution :
Assembly & Test, Infineon Technol. Asia Pacific Pte Ltd Corp, Singapore, Singapore
Abstract :
Two finite-element-analysis (FEA) models, 3D-slice model and 1/8 or octant model, were used to simulate the solder joint reliability of ball grid array (BGA) packages. The solders were treated as Anand´s viscoplastic material and their fatigue life was estimated by Darveaux´s model. Simulation results are compared with some Weibull analysis results of the temperature cycling on board (TCOB) tests. It is confirmed that a big solder resist opening (SRO) and soft solder resist material greatly improves the fatigue life of solder joints. A good correlation of the first failure location between testing and simulation was found by cross-sectioning. Mostly the corner ball in the center matrix failed first. Besides, effects of voids in the solder balls are also discussed and analyzed.
Keywords :
ball grid arrays; fatigue; finite element analysis; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; resists; thermal stresses; viscoplasticity; voids (solid); 3D-slice model; Anand viscoplastic material; BGA; Darveaux model; TCOB; Weibull analysis; ball grid array packages; center matrix corner ball failure; finite-element-analysis; octant model; soft solder resist material; solder ball void effects; solder joint fatigue life; solder joint reliability; solder resist opening; temperature cycling; Analytical models; Electronics packaging; Fatigue; Field emitter arrays; Finite element methods; Life estimation; Resists; Soldering; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271607
