DocumentCode
2609090
Title
Applications of X-Ray Energy Dispersive Analysis to Semiconductor Plastic Packages
Author
Riga, Giorgio ; Tang, Patrick
Author_Institution
Fairchild Central Analytical Laboratory, 464 Ellis St., MS 20-709, Mountain View, Ca. 94042. (415-962-2046)
fYear
1979
fDate
28946
Firstpage
209
Lastpage
212
Abstract
The plastic used in semiconductor packages can be readily characterized for filler and fire retardant content by X-ray-ED analysis. The technique can be used to monitor lot to lot process variations as well as uniformity of molded parts. It can be applied in incoming quality control as a quality indicator of the non polymerized plastic or the finished product. Reliability test failures can be analyzed to insure their identification, to measure the degree of surface contamination, or to perform correlation studies.
Keywords
Condition monitoring; Dispersion; Failure analysis; Flame retardants; Performance analysis; Plastic packaging; Polymers; Quality control; Semiconductor device packaging; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1979. 17th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1979.362895
Filename
4208288
Link To Document