Title :
Mechanical characterization of board-level 63Sn37Pb and lead-free solder sphere attachment on Cu-pad/Ni/Au surface finish substrate
Author :
Fan, Jia-Wei ; Kuo, Chia-Tai ; Yip, Ming-Chuen
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
The trends of miniaturization of the electronic products make the solder joint reliability become important. Solder joint reliability is closely related to the interfacial reaction. The increasing thickness of the brittle IMC (intermetallic compound) layer will degrade the joint integrity. Considering the IMC growth mechanism, shear test and failure mode analysis are used to completely understand the behavior of solder materials. Based on IMC experiment results, activation energy and diffusion coefficients of 63Sn37Pb, Sn3.5Ag and Sn4Ag0.5Cu were obtained, and the models of IMC growth mechanism at the interface between pad finish and the solder materials also have been established. Based on shear test and failure analysis, the variations of shear strength and failure mode transition of three different solder alloys are also discussed.
Keywords :
circuit reliability; copper; copper alloys; failure analysis; gold; lead alloys; nickel; shear strength; silver alloys; solders; tin alloys; Cu-Ni-Au-SnAg; Cu-Ni-Au-SnAgCu; Cu-Ni-Au-SnPb; activation energy; board-level solder sphere attachment; brittle IMC growth mechanism; diffusion coefficients; failure mode analysis; interfacial reaction; intermetallic compound layer; lead-free solder; pad surface finish; shear strength; shear test; solder joint reliability; Aging; Environmentally friendly manufacturing techniques; Failure analysis; Gold; Lead; Soldering; Surface finishing; Temperature; Testing; Thickness measurement;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271611
