Title :
Automating 1st level broadband component assembly
Author :
Evans, Daniel D., Jr. ; Chew, Wai Seng
Author_Institution :
Palomar Technol. Inc., Vista, CA, USA
Abstract :
Currently, broadband component manufacturers are utilizing automated equipment to process and assemble multi-chip die attach packages in a single pass on precision die attach equipment with mechanized substrate and die handling. Component manufacturers are designing new products that require multiple chips, attach, and connect technologies for improved cost, performance, and yield. Advances in automation will be essential to reducing component costs in the wireless and optical networks by implementing process technology advances that reduce assembly time and increase yield.
Keywords :
assembly planning; cost reduction; flip-chip devices; microassembling; multichip modules; process control; telecommunication equipment; automated equipment; broadband component assembly; flip chip; improved cost; improved performance; improved yield; level one components; multichip die attach packages; optoelectronic components; precision die attach equipment; reduced assembly time; single pass; Assembly; Broadband communication; Components, packaging, and manufacturing technology; Costs; Electronics packaging; Laser excitation; Manufacturing automation; Microassembly; Pump lasers; Standards organizations;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271619
