Assembly and prototype development of a 10Gbps optical transmitter package

Development of optoelectronic components for communications is converging towards access network applications where cost is a critical factor. The major contributor of today´s high component cost is packaging. One of the ways for reducing the cost of optical components is by low cost processes in assembling optoelectronic packages. Two low cost process technologies implemented in this study are the adhesive bonding of the fiber and the adhesive based package sealing. All other processes, like TEC attach, submount attach, LD attach etc are done using conventional metallurgical methods. Several packages are assembled and subjected to specific reliability testing as per telecordia guidelines. All the packages performs well under reliability test conditions and no fatality was observed. The results of this study are discussed in this paper.