DocumentCode :
2609320
Title :
Recent Advances in Al2O3 "In-Situ" Moisture Monitoring Chips for Cerdip Package Applications
Author :
Finn, J.B. ; Fong, V.
Author_Institution :
MOSTEK CORP., 1215 W. Crosby Road, Carrollton, TX 75006
fYear :
1980
fDate :
29312
Firstpage :
10
Lastpage :
16
Abstract :
Determination of the internal water vapor of a Cerdip package can be conveniently and inexpensively performed by an Al2O3 chip type sensor of recent design. Comparisons with an earlier design are made. Data of field trials by several IC manufacturers from common chip lots are shown. for the purpose of generating a broad range of moisture levels, both vitreous and non-vitreous sealing glass types were studied along with the effect of desiccants, lint contamination of the sealing glass, and the leak detection capability of the sensor. The relationship of sensor measured values with those of mass spectrometry is shown.
Keywords :
Aluminum oxide; Contamination; Glass manufacturing; Leak detection; Mass spectroscopy; Moisture; Monitoring; Packaging; Pollution measurement; Semiconductor device measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1980.362906
Filename :
4208302
Link To Document :
بازگشت