Title :
A model for film thickness using direct spray coating
Author :
Pham, Nga P. ; Burghartz, Joachim N. ; Sarro, Pasqualina M.
Author_Institution :
Lab. of Electron. Components, Technol. & Mater., Delft Univ. of Technol., Netherlands
Abstract :
This paper presents a model for film thickness using direct spray coating. The model reflects the dependence of film thickness on several parameters such as the solids content of the solution, the dispensed volume, the scanning speed of the spray head and the substrate\´s dimension. The model is verified with experimental data using spray coating of photoresist on 4" silicon wafers. A direct spray coating system (EVG 101) is used to perform the coating experiments. The model has been a great means to predict the thickness of the deposited layers, as well as to control and to understand the spray process.
Keywords :
aerosols; nozzles; photoresists; semiconductor process modelling; spray coating techniques; ultrasonic applications; 4 inch; Si; aerosol; deposited layer thickness; direct spray coating; dispensed volume; film thickness model; photoresist; silicon wafers; solution solids content; spray head scanning speed; substrate dimension; ultrasonic atomizer; ultrasonic spray nozzle; Coatings; Micromechanical devices; Optical films; Resists; Semiconductor device modeling; Silicon; Solids; Spraying; Substrates; Surface topography;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271622
