• DocumentCode
    2609544
  • Title

    Evaluation of the Pulse Ohmic Non-Linearity Technique as a Reliability Tool for Predicting Susceptibility to Electromigration Damage

  • Author

    Lloyd, J.R. ; Prokop, G.S. ; Molchen, M.E.

  • Author_Institution
    IBM, Hopewell Junction, N.Y. 12533
  • fYear
    1980
  • fDate
    29312
  • Firstpage
    88
  • Lastpage
    94
  • Abstract
    The degree of correlation between time to failure by electromigration stressing and pulse ohmic - non-linearity was found to depend markedly on the stress conditions. Only the highest stress and highest joule heating resulted in good correlation. Also, a simple resistance measurement was found to correlate as well with time to failure as pulse non-linearity. It was concluded that pulse non-linearity techniques are of limited usefulness as a reliability tool for all but those applications where severe joule heating is present.
  • Keywords
    Conductive films; Conductors; Current density; Electrical resistance measurement; Electromigration; Heating; Pulse measurements; Stress; Virtual manufacturing; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1980. 18th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1980.362919
  • Filename
    4208315