Title :
Evaluation of the Pulse Ohmic Non-Linearity Technique as a Reliability Tool for Predicting Susceptibility to Electromigration Damage
Author :
Lloyd, J.R. ; Prokop, G.S. ; Molchen, M.E.
Author_Institution :
IBM, Hopewell Junction, N.Y. 12533
Abstract :
The degree of correlation between time to failure by electromigration stressing and pulse ohmic - non-linearity was found to depend markedly on the stress conditions. Only the highest stress and highest joule heating resulted in good correlation. Also, a simple resistance measurement was found to correlate as well with time to failure as pulse non-linearity. It was concluded that pulse non-linearity techniques are of limited usefulness as a reliability tool for all but those applications where severe joule heating is present.
Keywords :
Conductive films; Conductors; Current density; Electrical resistance measurement; Electromigration; Heating; Pulse measurements; Stress; Virtual manufacturing; Voltage measurement;
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1980.362919