Title :
Induced stresses on silicon die by the molding process: experimental
Author :
Caruso, S. ; Frisina, F. ; Zafarana, R. ; Raciti, A.
Author_Institution :
STMicroelectron. Stradale Primosole, Catania, Italy
Abstract :
The induced stresses by two molding compounds on silicon chips are experimentally investigated. Determination of induced stresses is a very important step towards the research and development of new packages, and for layout optimization. The analysis has been carried out through a straightforward methodology based on a suitable model of the piezoresistive effect, which is shown by the semiconductor materials (silicon in the present case). The used method has been found effective to obtain a good evaluation of the stresses distribution due to the plastic packages. The investigation is carried out onto a TO220 package using two last generation compounds, and statistical measurement tools are applied to the experimental results. Finally, the induced stresses after reliability tests are determined and discussed
Keywords :
elemental semiconductors; integrated circuit packaging; integrated circuit reliability; integrated circuits; moulding; piezoresistance; silicon; Si; TO220 package; induced stresses; layout optimization; microelectronics; molding process; piezoresistive effect; plastic packages; reliability tests; research and development; semiconductor materials; silicon chips; silicon die; statistical measurement tools; stresses distribution; Conductivity; Electronics packaging; Microelectronics; Piezoresistance; Plastics; Semiconductor device packaging; Semiconductor materials; Sensor arrays; Silicon; Thermal stresses;
Conference_Titel :
Industry Applications Conference, 2000. Conference Record of the 2000 IEEE
Conference_Location :
Rome
Print_ISBN :
0-7803-6401-5
DOI :
10.1109/IAS.2000.882592