• DocumentCode
    2609623
  • Title

    Three Decapsulation Methods for Epoxy Novalac Type Packages

  • Author

    Byrne, W.Joe

  • Author_Institution
    National Semiconductor Corporation, 2900 Semiconductor Drive, Santa Clara, California 95051
  • fYear
    1980
  • fDate
    29312
  • Firstpage
    107
  • Lastpage
    109
  • Abstract
    The effectiveness and limitations of the methods for plastic removal, one using sulfuric acid at 230°C, another using nitric acid at 70°C are contrasted with a third using mechanical means at high temperature.
  • Keywords
    Aluminum; Etching; Metallization; Oxidation; Pins; Plastic packaging; Semiconductor device packaging; Surface contamination; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1980. 18th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1980.362923
  • Filename
    4208319
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2609623