DocumentCode :
2609623
Title :
Three Decapsulation Methods for Epoxy Novalac Type Packages
Author :
Byrne, W.Joe
Author_Institution :
National Semiconductor Corporation, 2900 Semiconductor Drive, Santa Clara, California 95051
fYear :
1980
fDate :
29312
Firstpage :
107
Lastpage :
109
Abstract :
The effectiveness and limitations of the methods for plastic removal, one using sulfuric acid at 230°C, another using nitric acid at 70°C are contrasted with a third using mechanical means at high temperature.
Keywords :
Aluminum; Etching; Metallization; Oxidation; Pins; Plastic packaging; Semiconductor device packaging; Surface contamination; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1980.362923
Filename :
4208319
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2609623
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