DocumentCode
2609653
Title
Linux Bugs: Life Cycle and Resolution Analysis
Author
Ahmed, Mohamed F. ; Gokhale, Swapna S.
Author_Institution
Dept. of Comput. Sci. & Eng., Connecticut Univ., Storrs, CT
fYear
2008
fDate
12-13 Aug. 2008
Firstpage
396
Lastpage
401
Abstract
Efforts to improve application reliability can fade if the reliability of the underlying operating system on which the application resides is not seriously considered. An important first step in improving the reliability of an operating system is to first gain insights into why and how the bugs originate, contributions of the different modules to the bugs, their distribution across severities, the different ways in which the bug may be resolved and the impact of bug severity on the resolution time. To gain this insight we conducted an extensive analysis of the publicly available bug data on the Linux kernel over a period of seven years. Our observations suggest that the Linux kernel may draw significant benefits from the continual reliability improvement efforts of its developers. These efforts, however, are disproportionately targeted towards popular configurations and hardware platforms, due to which the reliability of these configurations may be better than those that are not commonly used. Thus, a key finding of our study is that it may be prudent to restrict to using common configurations and platforms when using open source systems such as Linux in applications with stringent reliability expectations.
Keywords
Linux; operating system kernels; public domain software; software reliability; Linux bugs; Linux kernel; life cycle analysis; open source systems; operating system reliability; resolution analysis; Application software; Computer bugs; Computer science; Hardware; Kernel; Linux; Open source software; Operating systems; Reliability; Software quality; Architecture; Linux Bugs; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Software, 2008. QSIC '08. The Eighth International Conference on
Conference_Location
Oxford
ISSN
1550-6002
Print_ISBN
978-0-7695-3312-4
Type
conf
DOI
10.1109/QSIC.2008.55
Filename
4601569
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