Title :
Failure Analysis of Multilayer Ceramic Substrates
Author_Institution :
D/875 B/300-41C, IBM Corporation, Hopewell Junction, N.Y. 12533
Keywords :
Ceramics; Failure analysis; Glass; Lead; Nonhomogeneous media; Semiconductor device measurement; Stress measurement; Substrates; Temperature; Tin;
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1980.362944
