DocumentCode
2610153
Title
Some Considerations of the Gold-Silicon Die Bond Based on Surface Chemical Analysis
Author
Hoge, Carl E. ; Thomas, Simon
Author_Institution
BURROUGHS CORPORATION, TECHNOLOGY CENTER, 16701 WEST BERNARDO DRIVE, SAN DIEGO, CALIFORNIA 92127
fYear
1980
fDate
29312
Firstpage
301
Lastpage
311
Abstract
Die bond reliability using gold-silicon eutectic preforms was investigated and related to poor wetting of the integrated circuit and substrate by the alloy melt. Using a Scanning Auger Microprobe (SAM), surface and interfacial structures were analyzed and the conditions for bonding or non-bonding outlined.
Keywords
Bonding; Chemical analysis; Electric resistance; Gold; Microassembly; Packaging; Preforms; Silicon; Substrates; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1980.362957
Filename
4208353
Link To Document