Title :
Application of Step Stress to Time Dependent Breakdown
Author :
Anolick, Eugene S. ; Chen, Li-Yu
Author_Institution :
International Business Machines Corporation, F74/052, P.O. Box 390, Poughkeepsie, N.Y. 12602. 914-463-8705
Abstract :
A method of speeding up testing by step stressing is described. The mathematic models utilized, the theoretical and experimental results, and application to final failure rate estimates are shown.
Keywords :
Breakdown voltage; Dielectric breakdown; Dielectric devices; Electric breakdown; History; Mathematical model; Mathematics; Stress control; Temperature; Testing;
Conference_Titel :
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1981.362967
