DocumentCode :
2610319
Title :
NMOS Voltage Breakdown Characteristics Compared with Accelerated Life Tests and Field use Data
Author :
Hallberg, Ö
Author_Institution :
ELLEMTEL Utvecklings Aktiebolag, Box 1505, 125 25 Ã\x84LVSJö, Sweden
fYear :
1981
fDate :
29677
Firstpage :
28
Lastpage :
33
Abstract :
Statistics on voltage-accelerated failures of 4K NMOS RAM´s have been compared with accelerated life test data and with real field use data. It is concluded that it is possible to get long-term reliability information from fast overvoltage step stress tests such as 40 ms and 1.2 s dwell time per step. The correlation between step stress data and life-test failures representing the main population is good. It is possible to use this quick test for lot acceptance and to design a proper voltage screening for the particular batch under test. The need for conventional burn-in testing would thus be reduced.
Keywords :
Dielectric breakdown; Life estimation; Life testing; MOS devices; Personal communication networks; Qualifications; Statistical analysis; Stress; Temperature; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1981.362968
Filename :
4208367
Link To Document :
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