DocumentCode :
2610476
Title :
Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
Author :
Howell, J.R.
Author_Institution :
Microprocessor Products Group, Fairchild Camera and Instruments Corporation, 4800 Patrick Henry Drive, Santa Clara, CA 95051. (408) 987-9417
fYear :
1981
fDate :
29677
Firstpage :
104
Lastpage :
110
Abstract :
This paper presents the evaluation methods used to appraise the reliability of plastic/copper lead frame packaging systems. A discussion of the copper/epoxy system, suspected failure mechanisms, tests designed to explore these mechanisms, and data developed during this study are presented. The data presented indicates the copper/epoxy system can meet or exceed the reliability of the Alloy 42 system.
Keywords :
Bonding; Copper alloys; Costs; Gold alloys; Large scale integration; Lead; Microassembly; Plastic packaging; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1981.362981
Filename :
4208380
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2610476
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