Title :
A real-time machine vision system for solder paste inspection
Author :
Wu, Huihui ; Zhang, Xianmin ; Kuang, Yongcong ; Lu, Shenglin
Author_Institution :
Sch. of Mech. Eng., South China Univ. of Technol., Guangzhou
Abstract :
As surface mount technology (SMT) component pitches decrease, quality inspection of the solder paste depositing is critical in the process of surface mounting. Currently, the inspection for solder pastes are manly performed by laser-based systems, however, it is not practical due to high cost and low inspection speed. In this paper, a real-time inspection approach based on the machine vision was presented. Firstly, a new fast image matching method was applied to align the PCB and determination of region of interest. Secondly, the images of the PCB are analyzed and the two-dimensional (2D) feature and a pseudo-3D feature are obtained. Finally, the artificial neuron network was established for classification the solder pastes. A prototype is developed and experiment results are presented, which illustrate the validity of the approach.
Keywords :
computer vision; image matching; inspection; neural nets; production engineering computing; solders; surface mount technology; artificial neuron network; image matching method; laser-based systems; real-time machine vision system; solder paste inspection; surface mount technology; Chip scale packaging; Circuit faults; Costs; Image matching; Inspection; Machine vision; Printing; Real time systems; Soldering; Surface-mount technology; Inspection; Machine vision; Neuron network; Pseudo-3D feature; Solder Paste;
Conference_Titel :
Advanced Intelligent Mechatronics, 2008. AIM 2008. IEEE/ASME International Conference on
Conference_Location :
Xian
Print_ISBN :
978-1-4244-2494-8
Electronic_ISBN :
978-1-4244-2495-5
DOI :
10.1109/AIM.2008.4601660
