• DocumentCode
    2610896
  • Title

    The Effect of Oxygen and Argon on the Interdiffusion of Au-Al Thin Film Couples

  • Author

    Shih, Da-Yuan ; Ficalora, P.J.

  • Author_Institution
    International Business Machines Corporation, P. O. Box 390, Poughkeepsie, New York 12602
  • fYear
    1981
  • fDate
    29677
  • Firstpage
    253
  • Lastpage
    256
  • Abstract
    Thin film diffusion couples were prepared by a sequential deposition of Al and Au on clean glass substrates in an ultra-high vacuum system. Aluminum was deposited at a rate of 1 nm sec¿1 to a thickness of 0.6 ¿m and then 0.12 ¿m of Au, which was shuttered to cover half of the Al film, at a rate of 0.1 nm sec¿1. Diffusion annealing of the couples was carried out at 250°C for 45 minutes in 0.5 atm. of either oxygen or argon gas. Optical and SEM examination of the couples annealed in argon showed ball-like intermetallic compound formation across the entire film, that is, even on that part of the Al film which was not covered with Au. Those films which had been annealed in oxygen showed dendritic intermetallic formation only in the region where the Au covered the Al; the uncovered Al region of the film was clean. These observations are explained on the basis of adsorbed gas and its effect on surface diffusion.
  • Keywords
    Annealing; Argon; Glass; Gold; Intermetallic; Optical films; Oxygen; Sputtering; Substrates; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1981. 19th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1981.363005
  • Filename
    4208404