DocumentCode :
2610941
Title :
Improved impact-ionization modelling and validation with pn-junction diodes
Author :
Pan, Zhihao ; Holland, Steffen ; Schroeder, Dietmar ; Krautschneider, Wolfgang
Author_Institution :
NXP Semicond., Hamburg, Germany
fYear :
2010
fDate :
6-8 Sept. 2010
Firstpage :
287
Lastpage :
290
Abstract :
Impact-ionization at low and high electric field as well as the temperature dependence has to be modeled well in order to improve the predictive capability of TCAD tools. The high field behavior is of particular interest for ESD protection devices with low breakdown voltages which are used to protect ICs made with modern technologies. In this paper, the model for estimating the impact-ionization proposed by Valdinoci with the parameters of Reggiani has been examined with diodes of various breakdown voltages. It was found that the experimental breakdown voltages of the diodes are underestimated using that model. The cause was traced back to the overestimation of the electron impact-ionization coefficient at high electric fields. By adjusting the model parameters to the experiments of Van Overstraeten and Grant, who measured the impact-ionization coefficient in silicon for fields up to 7.7 × 105 V/cm, we extend the model´s validity to high fields. With the new parameter set, a much better agreement to the measured breakdown voltages is obtained. As a check for the temperature dependence of the impact-ionization, the diodes were further investigated under 100 ns transmission line pulses (TLP). The measured high-current I-V characteristic is well reproduced by simulations using the new model, as opposed to the well-established model based on Chynoweth´s law. Both the failure level and the damage location are well predicted by the simulation.
Keywords :
avalanche breakdown; avalanche diodes; electrostatic discharge; failure analysis; impact ionisation; p-i-n diodes; p-n junctions; semiconductor device breakdown; semiconductor device models; semiconductor process modelling; technology CAD (electronics); ESD protection devices; IC protection; TCAD predictive capability; breakdown voltage; damage location; electron impact-ionization coefficient; electrostatic discharge; failure level; high electric field behavior; high-current I-V characteristics; impact-ionization modelling; integrated circuit protection; model parameter set; pn-junction diodes; technology computer-aided design; temperature dependence; transmission line pulses; Current measurement; Electric fields; Electrostatic discharge; Silicon; Temperature measurement; Transmission line measurements; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location :
Bologna
ISSN :
1946-1569
Print_ISBN :
978-1-4244-7701-2
Electronic_ISBN :
1946-1569
Type :
conf
DOI :
10.1109/SISPAD.2010.5604503
Filename :
5604503
Link To Document :
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