• DocumentCode
    2611024
  • Title

    Multiphysics modeling of PCM devices for scaling investigation

  • Author

    Ferrari, G. ; Ghetti, A. ; Ielmini, D. ; Redaelli, A. ; Pirovano, A.

  • Author_Institution
    Politec. di Milano, Milan, Italy
  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    265
  • Lastpage
    268
  • Abstract
    A multiphysics model for Phase Change Memory (PCM) is calibrated on a large set of experimental data. Critical material and interface properties such as electrical and thermal resistivities and their dependence on temperature are extracted from data or fitting electrical characteristics with numerical simulations. The model is shown to match with a unique set of parameters experimental data from 90 nm and 45 nm technology nodes. The calibrated model is then exploited to perform a sensitivity analysis of key cell characteristics to geometry and material properties variations. Furthermore, the model is used to predict performance of a scaled down cell suitable for the 32 nm technology node and the results demonstrate the consistent scalability of PCM with respect to the technology node.
  • Keywords
    antimony compounds; chalcogenide glasses; electrical conductivity; germanium compounds; numerical analysis; phase change materials; semiconductor device models; tellurium compounds; thermal conductivity; Ge2Te2Sb5; PCM devices; cell characteristics; electrical resistivities; interface properties; numerical simulations; phase change memory; scaling investigation; sensitivity analysis; size 32 nm; size 45 nm; size 90 nm; thermal resistivities; Conductivity; Electrical resistance measurement; Numerical models; Phase change materials; Resistance; Resistance heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604509
  • Filename
    5604509