Title :
A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric Substrates
Author :
DerMarderosian, Aaron ; Nadeau, Roger ; Gionet, Vincent
Author_Institution :
Raytheon Company, Sudbury, Mass. 01776, (617) 443-9521
Abstract :
A method has been developed which quantitatively evaluates the integrity of leadless ceramic chip carrier (LCCC) mounting schemes. This method utilizes strain gages and compares mounted and unmounted LCCC´s during temperature tests. This technique enables the designer to evaluate critical material parameters with a single temperature excursion.
Keywords :
Capacitive sensors; Ceramics; Fatigue; Joining materials; Lead; Polymers; Soldering; Strain measurement; Temperature; Testing;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.363015
