DocumentCode

2611109

Title

Nondestructive Die Attach Integrity Test

Author

Porter, George

Author_Institution

Components Engineering Department, T R W, Defense And Space Systems, Group Of TRW Inc, One Space Park Redondo Beach California 90278

fYear

1982

fDate

30011

Firstpage

45

Lastpage

46

Keywords

Current measurement; Diodes; Heating; Microassembly; Nondestructive testing; Packaging; Performance evaluation; Pulse measurements; Sampling methods; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1982. 20th Annual

Conference_Location

San Diego, NV, USa

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1982.363020

Filename

4208422