DocumentCode :
2611109
Title :
Nondestructive Die Attach Integrity Test
Author :
Porter, George
Author_Institution :
Components Engineering Department, T R W, Defense And Space Systems, Group Of TRW Inc, One Space Park Redondo Beach California 90278
fYear :
1982
fDate :
30011
Firstpage :
45
Lastpage :
46
Keywords :
Current measurement; Diodes; Heating; Microassembly; Nondestructive testing; Packaging; Performance evaluation; Pulse measurements; Sampling methods; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1982.363020
Filename :
4208422
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2611109
