DocumentCode

2611187

Title

Elimination of Silicon Electromigration in Contacts by the use of an Interposed Barrier Metal

Author

Gargini, P.A. ; Tseng, C. ; Woods, M.H.

Author_Institution

INTEL CORPORATION, 3065 BOWERS AVENUE, SANTA CLARA, CALIFORNIA 95051

fYear

1982

fDate

30011

Firstpage

66

Lastpage

76

Keywords

Acceleration; Aluminum; Computer aided software engineering; Current density; Delay estimation; Electromigration; Failure analysis; Silicon; Stress; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1982. 20th Annual

Conference_Location

San Diego, NV, USa

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1982.363024

Filename

4208426