Title :
Precision Temperature Profiling in Highly Accelerated VLSI Life Test
Author :
Yu, Chen Cheng ; Swinton, Alexander J.
Author_Institution :
International Business Machines Corporation, All/052, P.O. Box 390, Poughkeepsie, N. Y. 12602
Abstract :
Discrete devices under high electrical stress can produce nonuniform junction temperature in a chip. Knowledge of precise junction temperature is essential for accurate reliability projection, since most failure mechanisms are highly temperature activated. Thermal conduction equations are solved analytically with appropriate boundary conditions for junction temperature calculation. Experiments performed on test chips show good correlation.
Keywords :
Boundary conditions; Equations; Failure analysis; Life estimation; Life testing; Performance evaluation; Temperature; Thermal conductivity; Thermal stresses; Very large scale integration;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.363034
