DocumentCode
2611409
Title
X-Ray Radiographic Techniques in Failure Analysis
Author
Jones, Larry
Author_Institution
Hewlett-Packard Company, 3404 E. Harmony Road, Fort Collins, Colorado 80525
fYear
1982
fDate
30011
Firstpage
152
Lastpage
155
Abstract
High resolution techniques in X-ray analysis are presented. These techniques are non-destructive and use inexpensive film such as Polaroid Type 52 and Type 55, with short exposure time. Examples are given using various common electrical and mechanical components such as semiconductors, variable resistors, fuses, connectors with the aid of a microfiche viewer.
Keywords
Aerospace materials; Circuit testing; Failure analysis; Fuses; Lead; Microscopy; Pins; Radiography; Semiconductor films; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location
San Diego, NV, USa
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1982.363036
Filename
4208438
Link To Document