• DocumentCode
    2611496
  • Title

    Simulation of line-edge roughness effects in silicon nanowire MOSFETs

  • Author

    Yu, Tao ; Wang, Runsheng ; Huang, Ru

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    187
  • Lastpage
    190
  • Abstract
    In this paper, the effects of nanowire (NW) line-edge roughness (LER) in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) are investigated by 3-D statistical simulation in terms of both performance variation and mean value degradation. A physical model is developed for NW LER induced performance degradation in SNWTs for the first time. The results indicate large performance mean value degradations due to NW LER in SNWTs. However, the LER induced parameter variation is still acceptable. In addition, as the LER correlation length (Λ) scales beyond the gate length, new distribution of performance parameters is observed, which has dual-peaks rather than single in conventional Gaussian distribution. The optimization for NW LER parameters is given for SNWT design as well.
  • Keywords
    MOSFET; elemental semiconductors; nanowires; optimisation; semiconductor device models; silicon; 3D statistical simulation; Si; gate-all-around; line-edge roughness effects; mean value degradation; optimization; parameter variation; silicon nanowire MOSFET; Degradation; Integrated circuit modeling; Logic gates; MOSFETs; Performance evaluation; Silicon; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604534
  • Filename
    5604534