DocumentCode
2611496
Title
Simulation of line-edge roughness effects in silicon nanowire MOSFETs
Author
Yu, Tao ; Wang, Runsheng ; Huang, Ru
Author_Institution
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
fYear
2010
fDate
6-8 Sept. 2010
Firstpage
187
Lastpage
190
Abstract
In this paper, the effects of nanowire (NW) line-edge roughness (LER) in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) are investigated by 3-D statistical simulation in terms of both performance variation and mean value degradation. A physical model is developed for NW LER induced performance degradation in SNWTs for the first time. The results indicate large performance mean value degradations due to NW LER in SNWTs. However, the LER induced parameter variation is still acceptable. In addition, as the LER correlation length (Λ) scales beyond the gate length, new distribution of performance parameters is observed, which has dual-peaks rather than single in conventional Gaussian distribution. The optimization for NW LER parameters is given for SNWT design as well.
Keywords
MOSFET; elemental semiconductors; nanowires; optimisation; semiconductor device models; silicon; 3D statistical simulation; Si; gate-all-around; line-edge roughness effects; mean value degradation; optimization; parameter variation; silicon nanowire MOSFET; Degradation; Integrated circuit modeling; Logic gates; MOSFETs; Performance evaluation; Silicon; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location
Bologna
ISSN
1946-1569
Print_ISBN
978-1-4244-7701-2
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2010.5604534
Filename
5604534
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