Non-Encapsulated Microsectioning as a Construction and Failure Analysis Technique

Non-encapsulated microsectioning is a procedure for cross sectioning LSI and VLSI electronic devices without encasing them in a mounting compound. This technique is faster, simpler, and more flexible than encapsulated methods, yet it provides the precision necessary to microsection these small devices. This cross-sectioning process is useful in construction analysis for measuring the dimensions of device structures. The precision of this method also allows the cross sectioning of defects in device structures during failure analysis.