• DocumentCode
    2611642
  • Title

    Thermal analysis of dual mechanical port machine for wind power application with co-simulation method

  • Author

    Sun, Xikai ; Cheng, Ming ; Hua, Wei ; Xu, Longya

  • Author_Institution
    Sch. of Electr. Eng., Southeast Univ., Nanjing, China
  • fYear
    2010
  • fDate
    9-12 May 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Dual mechanical port machine (DMP) - a kind of continuous electrical variable transmission, is a very competitive alternative for vulnerable constant speed-ratio mechanical gearbox in high capacity wind power generation system. As the inner rotor is surrounded by the stator and the outer rotor, the DMP machine suffers from PM demagnetization and insulation failure under severe thermal condition. To calculate the heat sources, like copper loss and iron loss more accurately, a transient co-simulation method which integrates the transient electromagnetic analysis into system circuit simulation and takes not only the spatial harmonics of the motor but also PWM and control logics into consideration is employed. The precise knowledge of temperature distribution and the design of cooling system are investigated by finite element method (FEM).
  • Keywords
    electric power generation; finite element analysis; pulse width modulation; rotors; stators; thermal analysis; wind power plants; DMP machine; FEM; PM demagnetization; PWM; constant speed-ratio mechanical gearbox; cosimulation method; dual mechanical port machine; electrical variable transmission; finite element method; rotor; temperature distribution; thermal analysis; transient electromagnetic analysis; wind power application; wind power generation system; Demagnetization; Electromagnetic heating; Electromagnetic transients; Insulation; Pulse width modulation; Rotors; Stators; Transient analysis; Wind energy; Wind power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Field Computation (CEFC), 2010 14th Biennial IEEE Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-7059-4
  • Type

    conf

  • DOI
    10.1109/CEFC.2010.5481585
  • Filename
    5481585