Title : 
Modeling interconnections with nonlinear discontinuities [in MCMs]
         
        
            Author : 
Schutt-Ainé, José E. ; Oh, Kyung S.
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
         
        
        
        
        
            Abstract : 
An efficient technique for modeling interconnections with nonlinear discontinuities is introduced. Interconnects are modeled with ideal transmission lines, and discontinuities are represented with The´venin equivalent circuits. The time-domain scattering parameter approach is employed to obtain recursive expressions for the voltage waves at the discontinuity junction. The resulting simulation algorithm avoids the use of convolution or a Fourier transformation and achieves the linear order of the computation time complexity with respect to the number of time steps. The computer program is written and used to demonstrate the effects of periodical capacitive loadings
         
        
            Keywords : 
S-parameters; circuit CAD; computational complexity; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; multichip modules; time-domain analysis; transmission line theory; The´venin equivalent circuits; computation time complexity; ideal transmission lines; nonlinear discontinuities; periodical capacitive loadings; recursive expressions; time steps; time-domain scattering parameter; voltage waves; Circuit simulation; Computational modeling; Convolution; Distributed parameter circuits; Equivalent circuits; Integrated circuit interconnections; Scattering parameters; Time domain analysis; Transmission line discontinuities; Voltage;
         
        
        
        
            Conference_Titel : 
Circuits and Systems, 1993., ISCAS '93, 1993 IEEE International Symposium on
         
        
            Conference_Location : 
Chicago, IL
         
        
            Print_ISBN : 
0-7803-1281-3
         
        
        
            DOI : 
10.1109/ISCAS.1993.394176