DocumentCode :
2612649
Title :
Application of 1018.2 to Hybrid and VLSI Devices
Author :
Ebel, G.H.
Author_Institution :
Singer Company, Kearfott Division, 150 Totowa Road, Wayne, New Jersey 07470. (201) 785-6656
fYear :
1983
fDate :
30407
Firstpage :
274
Lastpage :
281
Abstract :
This paper discusses several methods used to determine the amount of moisture within a hybrid or LSI package. Case histories are used to show that moisture measurements alone are not sufficient to analyze most problems. RGA (Residual Gas Analysis) provides data that is invaluable in determining the source of moisture within the package. Several possible sources of moisture will be presented. The results from extensive RGA analyses of hybrids show the validity of this type of testing. Finally recommendations for changes to test method 1018 of MIL-STD-883 as applied to hybrids and VLSI devices are presented. These include: 1) recommended times and temperatures for baking of the device prior to RGA analysis; 2) the time windows for testing after removal from the oven; and 3) acceptable levels of moisture for hybrids and VLSI devices.
Keywords :
Aluminum oxide; Conductivity; Data analysis; History; Large scale integration; Moisture measurement; Packaging; Temperature sensors; Testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1983. 21st Annual
Conference_Location :
Phoenix, AZ, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1983.361996
Filename :
4208517
Link To Document :
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