Experiment study on bonding tool of thermosonic transducer for flip-chip bonding

The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.