Title :
Scheduling LED Packaging and Testing Operations on Die Bonder
Author :
Chuang, Tien His ; Yu, Cheng Wei ; Huang, Chun Chia
Author_Institution :
Dept. of Ind. Eng. & Syst. Manage., Chung Hua Univ., Hsinchu, Taiwan
Abstract :
Die bonder is an important process operation but also often the cause of bottlenecks in LED packaging and testing factories. Therefore, the development of an effective scheduling method to minimize makespan in this die bonder process is essential and difficult. In the LED(Light-emitting diode) packaging and testing scheduling problem (LEDPTSP), jobs are clustered by their product types, which must be processed on identical parallel die bounder machines. The setup times for two consecutive jobs between different product types in the machines are sequence-dependent. In this paper, the LEDPTSP is formulated as a integer linear programming model and use Cplex to solve the real- world case.
Keywords :
electronics packaging; integer programming; job shop scheduling; light emitting diodes; linear programming; microassembling; parallel machines; identical parallel die bounder machines; integer linear programming model; light-emitting diode; scheduling LED packaging; testing operations; Bonding; Conference management; Engineering management; Industrial engineering; Job shop scheduling; Light emitting diodes; Packaging; Springs; System testing; Technology management; bottlenecks; identical parallel machines; integer linear programming; makespan; setup times;
Conference_Titel :
Computer Science and Information Technology - Spring Conference, 2009. IACSITSC '09. International Association of
Conference_Location :
Singapore
Print_ISBN :
978-0-7695-3653-8
DOI :
10.1109/IACSIT-SC.2009.124