DocumentCode

2613279

Title

AES/ESCA/SEM/EDX Studies of Die Bond Materials and Interfaces

Author

Li, Tom P.L. ; Zigler, E.L. ; Hillyer, D.E.

Author_Institution

MARTIN MARIETTA ORLANDO AEROSPACE, ORLANDO, FLORIDA

fYear

1984

fDate

30773

Firstpage

169

Lastpage

174

Keywords

Aerospace materials; Bonding; Failure analysis; Gold; Microassembly; Microelectronics; Packaging; Preforms; Silicon; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1984. 22nd Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1984.362039

Filename

4208563