Title :
Initial Wetting and Reaction Sequences in Soldering
Author :
Walker, G.A. ; DeHaven, P.W.
Author_Institution :
IBM Corporation, East Fishkill Facility, Building 300-41C, Hopewell Junction, New York 12533
Keywords :
Copper; Gold; Intermetallic; Kinetic theory; Monitoring; Soldering; Strips; Substrates; Tin; X-ray diffraction;
Conference_Titel :
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1984.362041
