DocumentCode
2613396
Title
Reduction of VT Shift Due to Avalanche-Hot-Carrier Injection using Graded Drain Structures in Submicron N-Channel MOSFET
Author
Noyori, M. ; Nakata, Y. ; Odanaka, S. ; Yasui, J.
Author_Institution
Central Research Laboratory, Matsushita Electric Industrial Co., Ltd., 3-15 Yakumo-nakamachi, Moriguchi, Osaka, JAPAN 570
fYear
1984
fDate
30773
Firstpage
205
Lastpage
209
Abstract
In order to evaluate the VT shift due to hot-carriers in submicron n-channel FETs with several kinds of graded junction structures as compared with a conventional structures, long term stress tests were conducted. As a result, it was found that the VT shifts observed in these devices were caused not by channel-hot-electron but by an avalanche-hot-carrier, which is probably a hot hole, and that the VT shift can be suppressed pronouncedly by the graded drain structures. This paper describes VT shift characteristics due to avalanche-hot-carriers compared with those due to channel-hot-carriers as well as the analysis of VT shift reduction mechanism in the graded drain structured devices.
Keywords
Annealing; CMOS technology; Double-gate FETs; Etching; Ion implantation; Laboratories; MOSFET circuits; Plasma temperature; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1984.362046
Filename
4208570
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