Title :
Polyimide Adhesion Characteristics
Author :
Narechania, Rajesh G. ; Bruce, James A. ; Beach, Cherje A.
Author_Institution :
IBM General Technology Division, Essex Junction, VT 05452
Abstract :
The effects of surface treatment and cure temperatures on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirements for an adhesion promoter. Understanding the temperature cure to a polyimide adhesion strength at a nitride interface is also important.
Keywords :
Adhesives; Chemicals; Chemistry; Plasma materials processing; Plasma temperature; Polyimides; Resists; Silicon; Surface cleaning; Surface treatment;
Conference_Titel :
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1984.362048
