DocumentCode :
2613574
Title :
Acoustic Emission Study of Electromigration Damage in Al-Cu Thin Film Conductor Stripes
Author :
Severn, E.T. ; Huston, H.H. ; Lloyd, J.R.
Author_Institution :
IBM East Fishkill Facility, Hopewell Junction, NY 12533
fYear :
1984
fDate :
30773
Firstpage :
256
Lastpage :
258
Keywords :
Acoustic emission; Acoustic signal detection; Acoustic testing; Conductive films; Conductors; Electromigration; Integrated circuit testing; Passivation; Temperature; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1984.362055
Filename :
4208579
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2613574
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