Title :
Electromigration Evaluation - MTF Modeling and Accelerated Testing
Author :
Burkett, T.A. ; Miller, R.L.
Author_Institution :
Harris Semiconductor, P. O. Box 883, Melbourne. FL 32901-0101
Abstract :
Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.
Keywords :
Circuit testing; Conductors; Current density; Electromigration; Life estimation; Ovens; Passivation; Sputtering; Temperature; Vehicles;
Conference_Titel :
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1984.362057
