DocumentCode
2613644
Title
An approach to thermal placement in power electronics using neural networks
Author
Kos, Andrzej
Author_Institution
Inst. of Electron., Univ. of Mining & Metall., Krakow, Poland
fYear
1993
fDate
3-6 May 1993
Firstpage
2427
Abstract
The author deals with the optimum thermal placement of heat sources in hybrid power circuits. The combination of the original heuristic method and the Hopfield neural net is presented. Because of the introduced hierarchical approach, a significant reduction of the computational effort is achieved. In this case, before starting the optimization procedure the number of heat sources is reduced by grouping some of them into new imaginary sources. It causes a decrease of the number of processing elements and synapses in the neural net that results in finding the solution in a relatively short time
Keywords
Hopfield neural nets; circuit optimisation; cooling; integrated circuit packaging; network topology; power electronics; Hopfield neural net; computational effort; heat sources; heuristic method; imaginary sources; neural networks; power electronics; processing elements; synapses; thermal placement; Circuits; Cogeneration; Cooling; Hopfield neural networks; Intelligent networks; Neural networks; Neurons; Resistors; Temperature; Trigeneration;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1993., ISCAS '93, 1993 IEEE International Symposium on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-1281-3
Type
conf
DOI
10.1109/ISCAS.1993.394254
Filename
394254
Link To Document